High-speed, detailed and multi-functional IC Packaging process simulation++ EXPERT TIP ++
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Due to the trend of intellectualization and electric vehicles, global industries have rising demand on reliable IC product performance. Advanced IC packaging technology plays an increasingly critical role in manufacturing process. Moldex3D’s new potting simulation capabilities are now available for IC packaging users. The Pre-processing Wizard can quickly generate high-quality mesh, which saves model preparation time and helps users validate IC packaging design, reducing trial and error costs significantly.
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